In the realm of photonics, miniaturized, high-performance devices are crucial for various applications. With their unique optical and electronic properties, inorganic perovskites have emerged as a promising material for such devices. Researchers have developed an inorganic perovskite-based integrated photonic devices. The researchers detail a method for fabricating these devices using focused ion beam etching and present the results of their characterization, highlighting their potential for use in integrated optical chips.
Integrated photonic devices integrate multiple optical functions onto a single chip, offering miniaturization, reduced complexity, and enhanced performance. These devices are essential for optical communication, sensing, and information processing applications. Perovskites, a class of materials with the formula ABX3 (where A and B are cations and X is an anion), have garnered significant interest due to their tunable optical properties, efficient photoluminescence, and extended carrier lifetimes – all qualities that make them suitable for diverse photonic applications.
The researchers developed a method for fabricating these devices using focused ion beam (FIB) etching, a high-resolution milling technique for creating precise patterns in thin films. The method involves depositing a thin perovskite film on a substrate, followed by FIB etching to define the desired device patterns. This process yields high-quality patterns with smooth sidewalls and minimal damage to the surrounding material.
These findings demonstrate the potential of inorganic perovskite-based active multifunctional integrated photonic devices for various applications in integrated optical chips, including optical communication, sensing, and information processing. Furthermore, the FIB etching fabrication method paves the way for high-volume manufacturing, while the tunable optical properties of perovskites enable the development of devices with customized functionalities.
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